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I started this blog as a way of recording my thoughts and experiences of being a new mum. Over time I hope to include my thoughts and experiences of living with Fibromyalgia.
Tuesday, October 24, 2011
update
I know it's been a while since I last posted but it feels like I have been writing this blog for years! Life has been hectic of late and I have really enjoyed having a bit of time to myself, although it isn't always possible.
We have really enjoyed visiting my parents in North Wales and have had an excellent time. They have been so helpful and I couldn't have asked for a better welcome.
I have been spending some time with my good friend Kate and her son Wyatt. He is now 22 months and is such a cheeky little thing. He just seems to love being with his mum and it is wonderful to spend time with a child who doesn't tire easily and doesn't need to be fed every 10 minutes.
I look after my Mum and her house is so beautiful that I have been reluctant to leave. In truth I feel like I am living in a dreamland and I am not sure if I want to return to normal life.
It seems that life has been getting in the way of the blogging and just about to get back to it!The present invention relates to a semiconductor device having a multilayer wiring structure. More specifically, the present invention relates to a technique effectively applied to a semiconductor device having a multilayer wiring structure which is obtained by layering wiring layers via a low-permittivity insulator film.
As a technique for realizing high-speed response and reduction in power consumption, a technique is known in which a multilayer wiring structure having a low-permittivity insulator film sandwiched between wiring layers is used.
A conventional semiconductor device having a multilayer wiring structure will be described with reference to FIGS. 14 and 15.
A semiconductor chip of a conventional semiconductor device is composed of a semiconductor substrate 1, a semiconductor circuit 2, a bonding pad 3, and a sealing resin 4. The bonding pad 3 is electrically connected to a lead frame (not shown) via a bonding wire 5. The semiconductor circuit 2 and the bonding pad 3 are electrically connected to the semiconductor substrate 1 via a conductive layer 6.
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